With the breakthrough of our company's process technology, Uniwell's Semi Flex PCB products have strong reliability, good bending performance, and increasingly high cost-effectiveness, and have been recognized by a large number of customers, with more and more orders. In order to better serve customers and meet their product needs, the following will introduce the application, characteristics, and process technology of semi flexible board and polycarbonate semi flexible board.
Due to the use of thin rigid FR4 board or semi flexible CCL instead of polyimide FCCL, this technology can greatly reduce its production cost.
adopts rigid thin FR4 material, which has a lower water absorption rate than flexible PI material, and does not require tempering and baking before further processing.
like R-FPC (multiflex), can have the possibility of three-dimensional installation.
Pure FR4 rigid laminate, controlled depth milling and thinning, can be used as a flexible bending zone by controlling the area that needs to be bent to a certain thickness. This process requires high precision in controlling the depth of the equipment, and the uniformity of the excess thickness is closely related to the flexural performance. Uneven thickness can easily cause the product to break during use.
FR4 is laminated with flexibility, and the PP sheet is pre opened in the area where flexibility needs to be exposed, while the rigid part is temporarily not opened. Finally, the suspended rigid area can be lifted off with a controlled depth milling machine, and the bent area of the circuit is protected with a flexible covering film or ink. This process carries the risk of compression indentation and semi flexible fracturing, which directly leads to loose film and defects in circuit production. In addition, overflow of glue causing difficulty in opening the cover is another difficulty.
FR4 is laminated with flexible materials, and before lamination, the FR4 and PP sheets use the rigid and flexible board technology with open windows at the parts that need to be bent. Due to the use of ordinary thin FR4 core boards or semi flexible materials as the bending area, this process also carries the risk of breakage and damage. Therefore, special care should be taken to protect it during the subsequent production process.